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                                 PRESS RELEASES

                     

PRESS RELEASE                                      FOR IMMEDIATE RELEASE

For More Information, Contact:                

Fred Garcia                                                                       August 25, 2008

Universal Semiconductor, Inc.
Tel:         +1 (408) 436 - 1906
Fax:        +1 (408) 436 - 1125
fgarciausi@sbcglobal.com

www.universalsemiconductor.com

  

USI Announces USA Based Micro-Optics Wafer Scale Business Unit

 SAN JOSE – August 25, 2008 - Universal Semiconductor, Inc., (USI), today announced it’s expansion of the Micro-Optics Wafer Scale Services offering a Turn Key design, prototyping and wafer fab production services.

 USI is no stranger to the emerging high growth Micro-Optics Wafer scale technology. For some three years coupled with the addition of pioneering experts in the field of Micro Optics, we have gained considerable experience and perfected Micro-Optic processes for our OEM customers said Vic. Hejmadi, CEO and President of USI.

 USI is unique in it’s knowledge, experience, and design and modeling capabilities in the field of binary and multilevel diffractive optics, hybrid refractive/diffractive and micro-refractive optics. USI uses highly effective custom-built CAD/CAM/CAE software to design, model and generate the mask layouts for micro-optical elements.

 USIs lithographic fabrication of the multilevel process achieves high field overlay accuracy, as well as resist reflow or gray scale masking in conjunction with dry proportional etching which enables USI to provide its customers the full spectrum of state of the art micro-optics fabrication processes.

 By their very nature, Micro-Optical elements have a typical footprint of only a few square millimeters and are usually less than 1 mm thick, making them ideal for applications in which space is at a premium. In addition, millions of components per month can be manufactured with high reliability and precision. So, it is easy to see why cost-effective Micro-Optic components are now fulfilling their promise by replacing conventional optics in common products like mobile phones, light-emitting-diode (LED) lighting, and flat-panel displays.

 The use of diffractive, hybrid diffractive/refractive and micro-refractive elements allow the designer a high degree of freedom to optimize a much more cost effective and low power consumption component for a given application said Fred Garcia, VP Marketing and Sales.

 “USI now addresses the high-growth market of Micro-Optic by expanding our Turnkey Foundry and Design Services, complimenting our ASIC, MEMS, and Photodiode Sensor products and services thus resulting in lower costs, greater performance and power benefits to the customer from a USA based company,” said Vic Hejmadi, CEO and President of USI.


 

PRESS RELEASE      APRIL 18, 2006

                                                                     FOR IMMEDIATE RELEASE

For More Information, Contact:                
Fred Garcia, VP Marketing 

Universal Semiconductor, Inc.

Tel: (408) 436 - 1906

Fax:  (408) 436 - 1125

sales@universalsemiconductor.com

www.universalsemiconductor.com

Universal Semiconductor (USI) expands its Turn Key wafer fab capabilities to include 6” wafer now offering 2", 3", 4", 5" and 6" wafer foundry services.

 USI’s expanded lithography equipment includes new submicron ASML PAS 2500/40 Stepper Aligner, Spinners, Lam and Tegal Dry Plasma Etchers for up to  6” wafers.

 

USI’s expanded Metal Deposition and  Diffusion  processes provide a diverse range of standard  processes or custom

<1 micron to 5 micron feature size or larger.

 

USI’s Patent Semiconductor technologies and processes include CMOS, DMOS, Bipolar devices, Double Diffusion Photodiodes / Detectors and Solar Cells.

 

USI offers a Turnkey Foundry resource for its customers that is extremely capable and competitively priced, said Vic Hejmadi, CEO and President of USI.

 

USI’s new 6” fab services will commence in May 2006 in addition to our on-going 2”- 5”. We also offer selected processes for 6” and 8” wafers said Vic Hejmadi.

 

USI utilizes its Semiconductor process technology, infrastructure and expertise by providing our customers with Made-In-America products that are cost effective, and reliable said Vic Hejmadi.

 

Universal Semiconductor is a private company founded in 1978, headquartered in San Jose, CA, is a custom-built class 10/1000 plant located in the heart of Silicon Valley at San Jose, CA.  The facility contains R &D, design engineering, custom and semi custom wafer fabrication, production test, prototype fabrication, sales and marketing, support, development, and manufacturing for its branded, custom and Foundry services.

 

USI offers a wide and diverse patented technology mix that have been designed to operate on the same chip: Analog/Digital; High Voltage Smart Power; CMOS, DMOS; Bipolar: RC/D Arrays, RF FETs, Photodiode, and Solar Cell.

 

For more information please visit USI’s Website at www.universalsemiconductor.com

 

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                                                                                     PRESS RELEASE   May 2004                                    FOR IMMEDIATE RELEASE

 

For More Information, Contact:                

Fred Garcia

Universal Semiconductor, Inc.
Tel: (408) 436 1906 X 43
Fax:  (408) 436 1125

sales@universalsemiconductor.com

www.universalsemiconductor.com

 

Universal Semiconductor (USI) expands its product offering with the addition of a line of Diffused Junction Silicon Photosensors for the defense and commercial markets.

 

The line of linear and Dual Axis Position, PIN and long Line series of Silicon Photodetectors offer rugged reliability, high resolution and long term stability at an extremely competitive price said Vic Hejmadi, CEO and President of USI.

 

Production of Silicon Photodiode Sensors actually commenced in the 4th quarter of 2003 and this year we will triple the production capacity and have plans to offer new products in the 4th quarter of 2004 said Vic Hejmadi.

 

USI utilizes its Semiconductor process technology, infrastructure and expertise by providing our customers with Made-in-America products that are cost effective and reliable, said Vic Hejmadi.

 

Universal Semiconductor is a private company founded in 1978, and is headquartered in a custom build class 10 plant located in the heart of Silicon Valley, San Jose, CA.  The facility contains R &D, design engineering, custom and semi custom wafer fabrication, production test, Prototype fabrication, sales and marketing.

 

USI offers a wide and diverse technology mix that have been designed to operate on the same chip: Analog/Digital; High Voltage Smart Power; DMOS, DMOS; Bipolar; RC/D Arrays and RF FETs.

 

For more information please visit USI's Website at www.universalsemiconductor.com

 

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PRESS RELEASE  August 2003                             FOR IMMEDIATE RELEASE

 

For More Information, Contact:                

Fred Garcia

Universal Semiconductor, Inc.
Tel: (408) 436 1906 X 43
Fax:  (408) 436 1125

sales@universalsemiconductor.com

www.universalsemiconductor.com

 

 

Universal Semiconductor (USI) has expanded into the MEMS technology market place and announces it's family of Pressure, Flow, and Temperature sensors for the automotive, medical, and commercial markets.

Universal Semiconductor's facility headquartered in San Jose, Ca is responsible for the development and manufacturing of Micro Electro Mechanical Systems (MEMS) for use in specific applications. 

 

Universal Semiconductor will offer custom application specific products as well as the manufacturing of MEMS chip and package level products to it's offering of semi custom and custom family of products and Fab Foundry services said Vic Hejmadi, CEO and President of USI.

 

The first production released is the Pressure Sensor Chip that is integrated with a highly sensitive piezoresistive pressure transducer, which provides an accurate, and linear voltage output.  The Pressure Sensor Chip contains a temperature sensor and test package and EEPROM for operational parameters all on 1 chip that minimizes costly engineering time and manufacturing cost.

 

The Pressure Sensor Chip is specifically designed for applications such as liquid/pneumatic, flow, and temperature compensator, for medical or a vast array of other like applications.

 

USI utilizes its Semiconductor process technology, infrastructure and expertise by providing our customers with miniaturized, cost effective, and reliable functions that is all on a single chip; a win-win solution for all said Vic Hejmadi.

 

Universal Semiconductor is a private company founded in 1978, and is headquartered in a custom build class 10 plant located in the heart of Silicon Valley, San Jose, CA.  The facility contains R &D, design engineering, custom and semi custom wafer fabrication, production test, Prototype fabrication, sales and marketing.

 

USI offers a wide and diverse technology mix that have been designed to operate on the same chip: Analog/Digital; High voltage Smart Power; CMOS, DMOS; Bipolar: RC/D Arrays, and RF FETs.

 

For more information please visit USI's Website at www.universalsemiconductor.com

 

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